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Guangzhou Hanker Electronics Technology Co., Ltd.

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Description

Model: 3D BGA Reballing Stencil A10
1.High accurate hole by laser making for easy solder pasting.
2.With magnet for the better accurate positioning.
3.Imported steel with high temperature resistence, not easy to bend out.
4.When pasting the tin, laser making hole can grant the reballing effect.
5.Double “X” groove shape design for Ventilation and not damage the IC

A10_02

A10_03

A10_04

A10_05

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