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  • High quality solder paste BAKU ba-5052/ba-5053/ba-5054 welding accessories PCB BGA repairing high impedance soldering paste flux

Description

  • ba-5052/5053/5054
  • microns: 25-28um
  • Melting point: 138/183/220℃
  • Feature: high impedance

 

High quality solder paste BAKU ba-5052/ba-5053/ba-5054 welding accessories PCB BGA repairing high impedance soldering paste flux

Are you tired of constantly searching for the right soldering materials to repair your mobile phone motherboard? Look no further than our mobile phone motherboard repair soldering materials kit!

Featuring lead-free soldering oil and tin paste, this kit is specially designed to make precision motherboard repairs a breeze. With high-quality materials and easy-to-use instructions, you can trust that your repairs will be seamless and effective.

Don't let a damaged motherboard hold you back any longer. Get your hands on our mobile phone motherboard repair soldering materials kit today!

#MobilePhoneRepair #MotherboardRepair #SolderingMaterialsKit #PrecisionRepairs #DIY #EasyRepairs #EfficientRepairs

 

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Product Overview: BA-5052 Series Lead-Free Solder Paste is specifically designed for precision circuit board repair in mobile phones. It offers different solder paste configurations with varying melting points to ensure optimal soldering results. With its high tin content, it creates smooth and shiny solder joints, providing excellent soldering performance.

 

  • Designed for precision circuit board repair: BA-5052 Series Lead-Free Solder Paste is developed for the repair of precision circuit boards in mobile phones, meeting high-quality repair requirements.
  • Different melting point configurations: The product offers multiple solder paste configurations with different melting points to cater to various soldering needs, ensuring the best soldering results.
  • High tin content: The solder paste has a high tin content, ensuring the formation of smooth and shiny solder joints, delivering exceptional soldering quality and reliability.
  • Enhanced soldering performance: The use of BA-5052 Series solder paste is user-friendly and improves soldering efficiency and effectiveness.
  • Other features: Reliable wetting and distribution properties, thermally stable chemical composition, high electrical and chemical reliability, low oxidation and low copper erosion for alloys, outstanding visual appearance.

 

 

 

 

 

 

 

 

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