Multi-Melting BGA Paste Set

The BAKU high-reliability no-clean BGA soldering paste four-piece set is specially developed for precision electronic maintenance scenarios. Four models accurately match different welding temperature requirements, and 35g large capacity meets high-frequency maintenance operations. The fine, viscous paste has strong adhesion, uniform tin-climbing without flying chips, and full, void-free solder joints after welding, greatly improving rework success rate. The corrosion-free formula is suitable for all PCB boards, and does not cake or deteriorate during long-term storage. Whether for chip rework, motherboard welding or precision component repair, this set of soldering paste achieves efficient, stable and high-quality welding effects, making it a must-have professional consumable for maintenance technicians!

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Packing List

ba-5052 Soldering Paste × 1

ba-5053 Soldering Paste × 1

ba-5054 Solder Paste × 1

ba-5055 Solder Paste × 1

✅ Multi-melting point adaptation: 4 models cover 138℃-220℃, suitable for full-scenario precision electronic maintenance like mobile chips and motherboards.
✅ No-clean formula: Minimal residue, bright & full solder joints, anti-corrosion & anti-oxidation, efficiently protects PCBs.
✅ Micron particles: 20-45μm size, fine paste with strong adhesion, avoids cold joints & voids, improves welding success rate.
✅ 35g large capacity: Sealed moisture-proof packaging, durable & anti-deterioration, meets high-frequency maintenance needs.