A lead-free, low-melting-point solder paste engineered for mainboard middle-layer reballing. It delivers high wettability, bright plump joints, minimal residue, and strong tin climbing. Non-corrosive and fault-free, it works perfectly on non-high-temp circuit boards for precision BGA/IC repairs.
Packing List
ba-5055 solder paste x 1
ba-229 solder flux x 1
ba-230 solder flux x 1
STAY CONNECTED
