High Activity Solder Paste Kit

1. No-clean Design: No extra cleaning required after soldering, saving time and reducing secondary damage.
2. Low Melting Point: Solder paste melts at 138°C, ideal for low-temperature repairs without damaging precision components.
3. Excellent Wettability: Prevents cold joints, bridging, tin beads and false soldering for smooth results.
4. Lead-free & Eco-friendly: Meets environmental standards, safe for various electronic repair scenarios.
5. Wide Compatibility: Perfect for BGA/CSP reballing, motherboard wiring, and chip repair.

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solder paste and flux kit combines low-temperature tin paste and premium lead-free flux. Ensures superior soldering performance with strong bonding force, easy application, and no post-cleaning needed. Ideal for mobile phone and circuit board repairs, preventing oxidation and ensuring long-lasting, stable connections. Compact sizes fit all repair station setups perfectly.

Packing List

ba-5052 Solder Paste × 1
ba-227 Lead-Free Solder Flux × 1