Our solder paste uses high-quality raw materials to ensure good soldering results and is suitable for a variety of electronic components. Whether it is a precision component or a high-power circuit board, our solder paste can provide stable and reliable soldering performance.
In order to ensure precise soldering results, our solder paste has good fluidity and appropriate viscosity, which can perfectly adapt to the soldering requirements of different electronics. The solder paste can form uniform solder joints when heated, effectively avoiding soldering defects and ensuring the firmness of the solder joints.
Low Temperature Solder Paste BA-5055
No false soldering, no cold soldering, and high reliability. It has good wettability and beautiful solder joints. There is very little residue after soldering, no need to clean, and the formula is mild and does not corrode PCB.
High Temperature Solder Paste BA-5054
It has excellent wetting properties and can quickly cover soldering surfaces to ensure the strength and reliability of solder joints. Good anti-oxidation properties, reduce oxidation and extend solder joint life. Special paste formula leaves very little residue and requires no cleaning.
It adopts lead-free formula, complies with environmental protection standards such as RoHS, and reduces environmental pollution. Good wettability and welding extensibility ensure that the solder joints are full and firm, effectively reducing problems such as cold solder joints and false solder joints.
Solder Paste for Electronics BA-5052
Excellent wettability and fluidity ensure the reliability and strength of solder joints. After soldering, the solder joints are bright and meet the strict requirements of high-reliability electronic assembly. There is very little residue after soldering, no need to clean, and improves production efficiency.
Lead-free solder paste and flux are made of high-quality materials, with good wettability and conductivity, and the solder joints are firm and not prone to cold soldering or desoldering. The lead-free environmentally friendly formula meets international standards and is safe and reliable.
BGA Syringe Tin Solder Paste BA-6351
High tin content enables excellent soldering performance and reliable solder joints. The syringe design allows for precise coating of solder joints to avoid excessive solder paste and circuit contamination.
Lead-Free Solder Paste BA-6352
The high tin content formula effectively improves the welding strength and conductivity, ensuring the durability of the solder joints. It has excellent wettability and flow characteristics, ensuring the solder joints are bright and smooth. There is little residue after soldering, it is non-sticky, non-corrosive, and does not require cleaning.
Using high-purity silver powder, the solder joint resistance is extremely low and the conductivity is excellent. There is very little residue after soldering, no need to clean, and it complies with RoHS environmental standards.
High tin content ensures firm and reliable soldering. After soldering, the surface of the solder joint is flat and bright, which improves the appearance quality of the solder joint and meets the welding requirements of high-end products. There is little residue after use, it is non-corrosive to components and PCB, and no cleaning is required, […]
Our lead-free solder paste has excellent temperature resistance and humidity adaptability, and can maintain stable soldering effects in high or low temperature and high humidity environments. After long-term use, the solder paste will not have problems due to environmental changes, and can always provide strong soldering support to avoid adverse consequences such as loose or falling solder joints.
For different soldering needs, we provide a variety of solder pastes that can adapt to different soldering conditions, such as high temperature, low temperature, or fast soldering. In addition, our solder paste is also subject to strict quality control and meets international soldering standards to ensure that it meets the high requirements of users.
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