| Model | RMA-625 BO |
| PH Value | -6.6 |
| CI | 0 |
| The best storage temperature | 5-10 °C in room temperature |
| Weight | 28g/ Piece(FULL) |
| Application | for mobile phone repair |
The RMA-625 BO is a high-performance lead-free and halogen-free solid soldering flux designed for modern electronic soldering needs, especially suitable for the repair of mobile phone BGA-IC chips and the soldering of PCB, BGA, PGA, and SMD components.
It can form a strong weld in a short time, reducing waiting time and improving work efficiency. Its effective wettability helps the solder to quickly combine with the metal surface, ensuring rapid formation during soldering and preventing overheating damage to components caused by long-term heating.
Moreover, the flux can provide stable chemical action during soldering, and will not corrode or damage sensitive electronic components and circuit boards, thereby ensuring that electronic equipment can operate stably for a long time after soldering.
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