BAKU BK-051G BGA Soldering Paste

High Tin Content: Ensures strong and reliable welds.
Round Bright Joints: Provides a visually appealing and durable finish.
Precision: Suitable for delicate work on mobile phone circuit boards.

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Alloy	sn 63% pb 37%
Mirons	25~45um
Net	50g(5~10°C)
Function	This is a must for small and mobile equipment maintenance products,Electronics and the production line,the best welding supplies.

Phone chip repair,computer or home appliance repair patch chip BGA-specific products.

The BA-051G Solder Paste is designed for precision repairs on mobile phone circuit boards. It is ideal for welding components and chips, featuring a high tin content for robust welds and round, bright solder joints.
Ideal for mobile phone technicians, electronics engineers, and DIY enthusiasts who require high-quality solder paste for precision repairs.

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