BAKU ba-676 Heating Platform
BAKU ba-676 Heating Platform
BAKU ba-676 Heating Platform
BAKU ba-676 Heating Platform
BAKU ba-676 Heating Platform
BAKU ba-676 Heating Platform

BAKU ba-676 Heating Platform

  • Designed for chip deprocessing and layer separation on mainboards
  • Constant temperature heating, with a maximum temperature of 200 degrees Celsius
  • Does not damage the chips, ensuring safe and efficient adhesive removal
  • Simple and stable operation, no need for a hot air gun
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  • DESCRIPTION

Model ba-676
Input voltage AC 220V or AC 110V
Power 50W
Temperature range 185 ℃ ~ 200 ℃
Heating time 3 minute
Usage For IC glue removing (A11, A12, A13); For middle layer separating Packing and shipping
Single package size 15X13X4 cm
Single gross weight 0.27kg

BA-676 Constant Temperature Adhesive Removal Board – Efficient Chip Deprocessing Tool

Product Description: Introducing the BA-676 Constant Temperature Adhesive Removal Board, a specialized tool designed for chip deprocessing and layer separation on mainboards. With its constant temperature heating technology, it can reach a maximum temperature of 200 degrees Celsius without damaging the chips, enabling quick and efficient adhesive removal. This adhesive removal board is simple, stable, and does not require a hot air gun, making it easy to operate.

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