Model | ba-676 |
Input voltage | AC 220V or AC 110V |
Power | 50W |
Temperature range | 185 ℃ ~ 200 ℃ |
Heating time | 3 minute |
Usage | For IC glue removing (A11, A12, A13); For middle layer separating Packing and shipping |
Single package size | 15X13X4 cm |
Single gross weight | 0.27kg |
BA-676 Constant Temperature Adhesive Removal Board – Efficient Chip Deprocessing Tool
Product Description: Introducing the BA-676 Constant Temperature Adhesive Removal Board, a specialized tool designed for chip deprocessing and layer separation on mainboards. With its constant temperature heating technology, it can reach a maximum temperature of 200 degrees Celsius without damaging the chips, enabling quick and efficient adhesive removal. This adhesive removal board is simple, stable, and does not require a hot air gun, making it easy to operate.