BAKU ba-6351 BGA Solder Paste
BAKU ba-6351 BGA Solder Paste
BAKU ba-6351 BGA Solder Paste
BAKU ba-6351 BGA Solder Paste
BAKU ba-6351 BGA Solder Paste

BAKU ba-6351 BGA Solder Paste

  • Should be stored in a refrigerator upon recepit at 0-10°C (32-50°F).
  • permit paste to reach room temperature prior to opening, this will prevent condensations moisture on the solder paste.
  • Low “deposit to deposit” variation drives maximisation of first pass print and reflow yields.
  • High print deposit volumes and low volume variability down to 12mil (0.3mm) circle feature sizes.
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  • SPECIFICATION
  • DESCRIPTION

 

Model BK-6351
Net 33g
Alloy sn63%/Pb37%
Purity High
Quality Excellent
Package Size 152*113*93mm
Microns 25-45um
Certification RoHS

Product Overview: The BA-6351 Series Precision Solder Paste is specifically developed for precision circuit board repair in mobile devices. With its high tin content, it ensures excellent soldering results, producing shiny and smooth solder joints. This solder paste is a reliable choice for achieving precise and high-quality repairs.

Product Features:

  • High tin content: The BA-6351 Series solder paste contains a high percentage of tin, resulting in superior soldering performance and reliable solder joints.
  • Shiny and smooth solder joints: This solder paste delivers exceptional wetting and flow characteristics, ensuring solder joints with a bright and smooth appearance.
  • Precision circuit board repair: It is optimized for intricate and delicate repairs on mobile device circuit boards, meeting the demanding requirements of precision soldering.
  • Additional features: Excellent adhesion, low voiding, high thermal stability, easy reflow process control.

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