Model |
BK-6351 |
Net |
33g |
Alloy |
sn63%/Pb37% |
Purity |
High |
Quality |
Excellent |
Package Size |
152*113*93mm |
Microns |
25-45um |
Certification |
RoHS |
Product Overview: The BA-6351 Series Precision Solder Paste is specifically developed for precision circuit board repair in mobile devices. With its high tin content, it ensures excellent soldering results, producing shiny and smooth solder joints. This solder paste is a reliable choice for achieving precise and high-quality repairs.
Product Features:
- High tin content: The BA-6351 Series solder paste contains a high percentage of tin, resulting in superior soldering performance and reliable solder joints.
- Shiny and smooth solder joints: This solder paste delivers exceptional wetting and flow characteristics, ensuring solder joints with a bright and smooth appearance.
- Precision circuit board repair: It is optimized for intricate and delicate repairs on mobile device circuit boards, meeting the demanding requirements of precision soldering.
- Additional features: Excellent adhesion, low voiding, high thermal stability, easy reflow process control.