Adhesive removing stuff often been used in the electronic device repairing, we offer different liquid for it, such as screen separation IC sealing,ect.
Rapid decontaminationefficient and accurate, Clean, restore conductive stability,can prevent contact failure. Quick drying of insulationwithout residue. It has high insulation strength (35000 Volt /2.54 mm),fast volatilization speed and clean, no residue and impermeable etc.
BAKU ba-128 Universal Frame Adhesive Removing Liquid
Designed for Precision Circuit Board Chip Encapsulation and Removal, Exclusive Formulation, Chip-Safe, No Heat or Additional Equipment Needed, Enables Fast Chip Repairs.
BAKU ba-127 BAG IC Adhesive Removing Liquid
Designed for Precision Circuit Board Chip Encapsulation and Removal.