| Alloy | sn 63% pb 37% |
| Mirons | 25~45um |
| Net | 50g(5~10°C) |
| Function | This is a must for small and mobile equipment maintenance products,Electronics and the production line,the best welding supplies. |
This solder paste adopts a high tin content design to effectively improve the welding strength, ensure the solder joint is firm and the connection is reliable, and provide strong welding support for various high-precision electronic components. After the welding is completed, the formed solder joint presents a smooth, full, round, and metallic appearance.
Its melting point is 183°C, which can accurately control the melting point, effectively avoid component damage caused by excessive temperature, and take into account welding efficiency and safety. It is suitable for mobile phone chip repair, computer or home appliance chip BGA special product repair.
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