| Product Name | 3D BGA reballing stencil | ||
| Brand | BAKU | ||
| Model | A8: Contains all for iphone 6/6S
plus models all need to tin the IC and CPU model. |
A9: Contains all for iphone 6S/6S
plus models all need to tin the IC and CPU model . |
A10:Contains all for iphone 7/7
plus models all need to tin the IC and CPU model. |
| Applicable Scope | Big audio U0900 | Big audio U3500 | Large power U1801 |
| Baseband U_BB_RF | Baseband U_BB_RF | Intel baseband BB_RF | |
| Large power supply U1202 | Large power supply U2000 | Gaumai base with BB_RF | |
| Large radio frequency
U_WTR_RF |
NPC U3501_RF | NFC NFC_RF | |
| Small radio frequency
U_WFR_RF |
Small audio U3700 | Big audio U3101 | |
| Baseband power supply
U_PMICRF |
USB management U4500 | Baseband power supply
XCVR1_RF |
|
| Sensing IC U2201 | Baseband power supply
U_WTR_RF |
RF IC XCVRO_RF | |
| Black touch U1801
NFC U5301_RF |
RF IC U3700 | BCM477341 | |
| Small audio U1601 | CPU lower U0600 | CPU under the UO700 | |
| CPU Lower U0201 | CPU upper layer U0600 | CPU upper layer U0700 | |
| CPU upper layer U0201 | WIFI U5200_RF | WIFI WLAN_RF | |
| WIFI U5201_RF | Charging IC U2300 | Charging IC U2101 | |
| USB management U1700 | 20 # Universal U4000 | 20 # General U3703 | |
| 20 feet U5302_RF | Hard disk U1500 | Light control | |
| White touch U2401 | Small audio U3301 | ||
| Charging IC U1401 | USB management U4001 | ||
| Hard disk U0604 | Hard disk U1701 | ||
| Material | High-quality steel, anti-corrosion, high temperature | ||
| Net Weight | 10g / pieces | ||
| Product Size | 85 X 69 X 1 MM | ||
| Gross Weight | 17g / piece | ||
| With Packaging Size | 115 X 85 X 2 MM | ||
| Features | accuratea lignment,super high quality,stepped groove,easy to use | ||
| Package | 1. Double-sided protective film, scratch, to ensure that the original authentic original. | ||
| 2. Exquisite color box packaging, double protection. | |||
| Benefits | 1. Stepped groove design enables stencil to align with tinning position of IC rapidly | ||
| 2. The square holes design makes it easier to take out the formed solder balls. | |||
| 3. This 3D stencil is easy to use no matter you are a new or expert. | |||
| 4. High success rate of planting tin,the solder balls can be formed once after you are proficient. | |||
| 5. This 3D planting stencil is thicer than ordinary stencils in the market.
less tendency of defor mation makes its using life be longer. |
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The BGA reballing stencil is a high-precision tool designed for BGA chip replanting solder balls. It is made of high-quality stainless steel, has good corrosion resistance and high-temperature resistance, and is widely used in the maintenance and secondary processing of mobile phones, computer motherboards, game consoles, server chips and other fields.
It uses laser cutting technology to ensure that each hole position accurately corresponds to the chip pad, and the aperture tolerance is controlled at the micron level to avoid solder ball displacement or adhesion. The surface is flat and burr-free, and the solder ball is evenly placed, suitable for repeated use.
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