| Model | ba-676 |
| Input voltage | AC 220V or AC 110V |
| Power | 50W |
| Temperature range | 185 ℃ ~ 200 ℃ |
| Heating time | 3 minute |
| Usage | For IC glue removing (A11, A12, A13); For middle layer separating Packing and shipping |
| Single package size | 15X13X4 cm |
| Single gross weight | 0.27kg |
The BA-676 is a professional grade device designed for motherboard chip repair and glue removal. It provides a stable and safe operating experience through precise temperature control and efficient heating.
The preheating platform adopts advanced constant temperature control technology, which can stably control the platform temperature within the set range, up to 200°C, to meet the heat demand during chip disassembly and glue removal. Compared to conventional heat guns, the heat is distributed more evenly, avoiding the risk of damage caused by local overheating.
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