Lead-Free Solder Paste BA-6352

The BA-6352 is a lead-free solder paste developed specifically for the repair of precision circuit boards in mobile devices. It has a high tin content design to ensure excellent soldering results. It can efficiently achieve reliable solder joints and is widely used in the repair and soldering of complex circuit boards such as smartphones and tablets.

This solder paste has excellent wettability and flow characteristics. It can quickly and evenly form flat and bright solder joints on the pads, reducing the need for excessive use of solder, ensuring consistency and high-quality solder joints during the soldering process. As a lead-free solder paste, it complies with RoHS environmental regulations to ensure compliance with global environmental standards.