| Model | BK-6351 |
| Net | 33g |
| Alloy | sn63%/Pb37% |
| Purity | High |
| Quality | Excellent |
| Package Size | 152*113*93mm |
| Microns | 25-45um |
| Certification | RoHS |
The BA-6351 is a high-performance solder paste tailored for precision circuit board repair in modern mobile devices and high-density electronic products. It uses high-purity metal components and advanced flux formulas to ensure excellent solder joint quality and stable and reliable processes during soldering.
The solder paste has excellent wettability and fluidity, and can evenly spread and form smooth, residue-free, and cold-weld-free solder joints even in small pads and dense solder joint areas. After soldering, the solder joints are bright in color and full in appearance, which improves the professionalism and reliability of repairs.
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