| Net | 45g |
| Certificate | RoHs |
| Package | Kraft paper |
| Material | Solder flux: Rosin; Solder paste: tin, silver |
| Working temperature | 25~300℃ |
| Tin particle diameter | 25~38µm |
The soldering set contains lead-free flux and lead-free solder paste, providing professional support for various delicate electronic assembly tasks. The lead-free environmentally friendly formula is suitable for a variety of applications from circuit board soldering to micro-component installation.
The syringe design of this solder flux paste set facilitates precise coating on the solder joint area to avoid excessive solder paste and contamination of the circuit. Even in small or complex structures, it can be clean, tidy, and accurate. At the same time, its excellent wetting and penetration properties enable the solder to spread quickly, improving work efficiency and soldering firmness.