| Model | ba-5055 |
| Melting Point | 158°C |
| Bottle Color | White |
| Weight | 35g |
| Microns | 35~45um |
| MOQ | 120pcs |
| Temperature of Using | 160~170 |
| Certifcation | RoHS |
| Usage | Used for LED materials that are not resistant to high temperatures, not recommended for general products |
The BA-5055 is a low-temperature solder paste designed for high-precision electronic products. It is widely used in the soldering of temperature-sensitive components, especially for the soldering of micro components such as BGA packaging, LED, power modules, etc.
This solder paste uses a unique alloy ratio, and the soldering temperature is only 158℃, which greatly reduces the thermal damage that traditional high-temperature soldering may cause to components or PCBs. After soldering, the solder joints show a bright and full effect.
In addition, the solder paste has precise humidity control, is not easy to agglomerate, is smooth to scrape, and has moderate viscosity. It can maintain uniform coating even at small-pitch solder joints to avoid the occurrence of adverse problems such as false soldering and cold soldering.
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