| Model | ba-5053 |
| Melting Point | 183°C |
| Bottle Color | Green |
| Weight | 35g |
| Microns | 25~28um |
| MOQ | 120pcs |
| Temperature of using | 190-200℃ |
| Certifcation | RoHS |
| Usage | Suitable for basic PCB componentmaintenance, commonly used |
The BA-5053 is a high-performance, lead-free and environmentally friendly BGA solder paste with a melting point of 183℃. It is suitable for electronic components that are sensitive to welding temperature, effectively avoiding damage to components due to high temperature, and is widely used in modern electronic manufacturing and precision welding processes.
This welding paste has good wettability, excellent welding reliability, and excellent thermal stability, and is an ideal choice for improving welding quality and ensuring component safety. There is less residue after welding, and no additional cleaning is required.
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