| Model | ba-127 |
| Application | Softening & removing resinating I sealing glue of chip BGA IC |
| Product Name | BGA IC Adhesive Removing Liquid |
| Capacity | 20ml (FULL) |
The BA-127 is a professional-grade adhesive removal liquid developed specifically for precision repair and rework needs in the electronics industry, focusing on solving the problem of removing high-strength adhesives on tiny components.
This adhesive removing liquid has extremely strong penetration and dissolving power, can quickly act on colloids (various types of glue such as black glue, red glue, green oil, etc.), quickly softens and decomposes high-strength glue layers, greatly improves rework efficiency, shortens operation time, and is especially suitable for glue removal in BGA chips, IC packages, and motherboard chip areas.
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