| Model | ba-126 |
| Certificate | ISO9001 |
| Solidified Temperature | 110-120℃ ×10-15min |
| Heat-patience | 260±5℃ 10s 3 times |
| Smallness (μm) | ≤10 |
| Viscosity (centipoise 25℃) | 200±50ps |
| Hardness | ≥6H |
| Attach | 100/100 |
| Net | 8g(FULL) |
This solder mask can be cured quickly under UV light. Compared with traditional thermal curing methods, UV curing technology can greatly shorten the curing time, reduce waiting time, and improve efficiency.
Moreover, it has excellent heat resistance. Even under high-temperature soldering conditions, it can still maintain the integrity and stability of the film layer and will not be affected by temperature changes during soldering. This allows it to provide long-lasting protection in the soldering of various complex electronic components. At the same time, the solder mask also provides excellent electrical insulation properties, effectively preventing electrical short circuits and other electrical faults.
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